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Superior in clean level, tensile strength, and elongation.
Suitable for packaging HDD parts, backlight unit, products after precision cleaning (ex. chip tray, carrier case, wafer, semiconductor manufacturing machines), and substrates such as silicon and glass wafer, mostly in electronics field.

Excellent in clean level, tensile strength, elongation, and modulus.
suitable for packaging clean room products (ex. Clean room smocks, clean room boots, and clean room gloves), and particle sensitive and highly efficient electronics materials.

Superior in transparency and flexibility
Suitable for packaging medical devices (ex. tube) and medical and food additives for sending out capsules, and pharmaceutical raw materials. It is also used as fillers for bottle package and during the pharmaceutical manufacturing process to transfer.

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